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主な生産パッケージ仕様一覧

・USB-A（Ultra Small Board：ノンリード・ガラエポ基板）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
4 2.10 x 1.40 x 0.60 0.65 glass epoxy 1.10 x 0.76 x t0.20
4 1.30 x 0.90 x 0.55 0.50 glass epoxy 0.60 x 0.60 x t0.15
4 1.50 x 2.00 x 0.65 0.80 glass epoxy 0.53 x 0.53 (2chip)
6 2.00 x 1.80 x 0.85 0.50 glass epoxy 1.00 x 1.40 x t0.27
6 2.00 x 1.80 x 0.70 0.50 glass epoxy 1.00 x 1.40 x t0.25

・USB-B（Ultra Small Board：ノンリード・Ni電鋳転写リード）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
3 1.20 x 1.20 x t0.60 0.60 (Ni) electro-
forming		 0.54 x 0.84 x t0.20
4 1.20 x 1.60 x t0.60 0.60 (Ni) electro-
forming		 0.60 x 0.80 x t0.25
6 2.00 x 1.80 x t0.60 0.50 (Ni) electro-
forming		 0.82 x 1.22 x t0.20
6 2.00 x 1.80 x t0.70 0.50 (Ni) electro-
forming		 0.82 x 1.22 x t0.20
10 2.60 x 2.90 x t0.60 0.50 (Ni) electro-
forming		 1.40 x 2.30 x t0.21
12 2.30 x 2.80 x t0.60 0.40 (Ni) electro-
forming		 1.10 x 1.00 x t0.20
(Ag paste)
12 2.30 x 2.80 x t0.60 0.40 (Ni) electro-
forming		 1.30 x 1.10 x t0.25
(dielectric:絶縁)

・USB-C（Ultra Small Board：ノンリード・Cu frame）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
8 5.00 x 4.50 x t0.75 1.00 Cu 2.50 x 3.50 x t0.25

 

・LNC（Lead Number Choose：ノンリード・ガラエポ基板）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
4 2.85 x 1.15 x t0.75 0.65 glass epoxy 1.85 x 0.75 x t0.25
6 2.85 x 1.80 x t0.75 0.65 glass epoxy 1.85 x 1.40 x t0.25
8 2.85 x 2.45 x t0.65 0.65 glass epoxy 1.85 x 2.05 x t0.25
10 2.85 x 3.10 x t0.80 0.65 glass epoxy 1.85 x 2.70 x t0.25
12 2.85 x 1.80 x t0.80 0.65 glass epoxy 1.80 x 3.35 x t0.25
14 2.85 x 4.40 x t0.80 0.65 glass epoxy 1.85 x 4.00 x t0.25

・QFN（Quad Flat Non-leaded：ノンリード・ガラエポ基板）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
6 1.00 x 1.20 x t0.45 0.80 glass epoxy 0.70 x 0.50 x t0.13
8 1.50 x 1.50 x t0.60 0.50 glass epoxy 0.80 x 0.80 x t0.25
8 1.50 x 1.50 x t0.80 0.50 glass epoxy 0.80 x 0.80 x t0.25
12 2.35 x 2.35 x t0.80 0.50 glass epoxy 1.65 x 1.65 x t0.30
16 2.85 x 2.85 x t0.80 0.50 glass epoxy 1.95 x 1.95 x t0.25

・SOT-23（リードパッケージ・Cu frame）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
3 1.60 x 2.90 x t1.10 1.90 Cu 1.00 x 1.00
5 1.60 x 2.90 x t1.10 0.95 Cu 1.30 x 1.00
6 1.60 x 2.90 x t1.10 0.95 Cu 1.30 x 0.80

・SOT-89（リードパッケージ・Cu frame）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
3 2.50 x 4.50 x t1.50 1.50 Cu 1.50 x 1.30
5 2.50 x 4.50 x t1.50 1.50 Cu 1.50 x 1.30

・SOP（リードパッケージ・Cu frame）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
8 3.9 x 4.9 x t1.6 1.27 Cu –
24 5.3 x 8.2 x t1.9 0.65 Cu –

・TSSOP（リードパッケージ・Cu frame）

pin package size
(mm)		 lead pitch
(mm)		 substrate
(lead frame)		 max. chip size
(mm)
8 4.4 x 3.1 x t1.1 0.65 Cu –
16 4.4 x 5.0 x t1.0 0.65 Cu –
20 4.4 x 6.5 x t1.1 0.65 Cu –
24 5.6 x 7.8 x t1.1 0.65 Cu –